Anastasia Barabash

91 to 94 of 94

25SEP 2018
Devices
Generation of 3D Functional Structures for High-Frequency Applications by Printing Technologies
Ankenbrand, M., Scheetz, M., Franke, J., Lomakin, K., Sippel, M., Gold, G., Helmreich, K 2018 13th International Congress Molded Interconnect Devices (MID) (pp. 1-5). IEEE In this work, the aerosol-based digital printing process Nanojet is utilized to additively generate conductive microstrip lines (MSL). The operating principle of this technology is described in sec. II. The […]
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28SEP 2016
Devices
Integration of polymer optical waveguides by using flexographic and aerosol jet printing
Reitberger, T., Franke, J., Hoffmann, G. A., Overmeyer, L., Lorenz, L., Wolter, K. J. 2016 12th International Congress Molded Interconnect Devices (MID), Wuerzburg, Germany, 2016, pp. 1-6 As a tribute to the continuously increasing volume of data traffic, optical waveguides have become a serious alternative to electrical circuitries. The potential of precise spaceresolved strain measurements […]Reitberger, T., Franke, J., Hoffmann, G. A., Overmeyer, L., Lorenz, L., Wolter, K. J. 2016 12th International Congress Molded Interconnect Devices (MID), Wuerzburg, Germany, 2016, pp. 1-6 As a tribute to the continuously increasing volume of data traffic, optical waveguides have become a serious alternative to electrical circuitries. The potential of precise spaceresolved strain measurements […]
Read more about Integration of polymer optical waveguides by using flexographic and aerosol jet printing
07DEC 2011
Devices
Electrical functionalization of thermoplastic materials by Aerosol Jet Printing
Hoerber, J., Goth, C., Franke, J., Hedges, M. 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, 2011, pp. 813-818 Aerosol-Jet-Printing is an interesting approach to apply circuit tracks on three dimensional thermoplastic circuit carriers used for Molded Interconnect Devices. Therefore, possibilities for printing nanoparticle silver inks on substrate materials that meet the requirements for basic […]Hoerber, J., Goth, C., Franke, J., Hedges, M. 2011 IEEE 13th Electronics Packaging Technology Conference, Singapore, 2011, pp. 813-818 Aerosol-Jet-Printing is an interesting approach to apply circuit tracks on three dimensional thermoplastic circuit carriers used for Molded Interconnect Devices. Therefore, possibilities for printing nanoparticle silver inks on substrate materials that meet the requirements for basic […]
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01JUN 2011
Devices
Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applications
Goth, C., Putzo, S., Franke, J 2011 IEEE 61st electronic components and technology conference (ECTC) (pp. 1211-1216) Printing technologies allow the production of fine pitch electronic applications supporting further miniaturization of mechatronic systems. Aerosol Jet ® is an innovative non-contact and maskless printing process for fine structures below 50 μm with the possibility to process […]Goth, C., Putzo, S., Franke, J 2011 IEEE 61st electronic components and technology conference (ECTC) (pp. 1211-1216) Printing technologies allow the production of fine pitch electronic applications supporting further miniaturization of mechatronic systems. Aerosol Jet ® is an innovative non-contact and maskless printing process for fine structures below 50 μm with the possibility to process […]
Read more about Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applications